Journals Communications in Information and Systems

Communications in Information and Systems Editors-in-Chief: Wing-Shing Wong and Stephen S-T. Yau ISSN: 1525-7555 Issues: 4/year Subscription Price: US$280.00 (including S&H)***

Communications in Information and Systems (CIS) is a journal sponsored by The Institute of Mathematical Sciences, The Chinese University of Hong Kong (IMS, CUHK), and published by International Press.

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Honorary Editor: Shing-Tung Yau, Department of Mathematics, Harvard University, Cambridge, MA 02138, USA Editors-in-Chief: Wing-Shing Wong, Department of Information Engineering, The Chinese University of Hong Kong, Shatin, N.T. Hong Kong, wswong@ie.cuhk.edu.hk   Stephen S.-T. Yau, Department of Mathematics, Statistics and Computer Science, M/C 249, University of Illinois at Chicago, Chicago, IL 60607, USA, yau@math.uic.edu Editors-at-Large: Brian D. Anderson, Australian National University, Research School of Information Science and Engineering, Canberra, Act0200, Australia, Brian.Anderson@anu.edu.au   Suguru Arimoto, Dept. of Robotics, Ritsumeikan University, Kusatsu, Shiga 525-8577, Japan, arimoto@se.ritsumei.ac.jp   Jie Huang, Dept. of Automation and Computer-Aided Engineering, The Chinese University of Hong Kong, Shatin, N.T., Hong Kong, jhuang@acae.cuhk.edu.hk   Thomas Kailath, Information Systems Laboratory, Stanford University, Stanford, CA 94305-9510, USA, kailath@stanford.edu   Sanjoy Mitter, Department of Electrical Engineering and Computer Science, MIT, Cambridge, MA 02139, USA, mitter@mit.edu   Shankar Sastry, Dept. of EECS, University of California, Berkeley, Berkeley, CA 94720, USA, sastry@eecs.berkeley.edu   Raymond W. Yeung, Dept. of Information Engineering, The Chinese University of Hong Kong, Shatin, N.T. Hong Kong, whyeung@ie.cuhk.edu.hk   Editors: John Baillieul, College of Engineering, Boston University, Boston, MA 02215-2407, USA, johnb@bu.edu   Peter Caines, Dept. of ECE, McGill University, Montreal, QC, Canada H3A 1T8, peterc@cim.mcgill.edu   Xiren Cao, Department of Electrical and Electronic Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, eecao@ust.hk   Lei Guo, Institute of Systems Science, Chinese Academy of Science, Beijing 100080, P. R. China, lguo@iss03.iss.ac.cn   Toshio Fukuda, Center for Cooperative Research in Advanced Science and Technology, Nagoya University, Furo-cho, Chikusa-ku, Nagoya 464-8603, Japan, fukuda@mein.nagoya-u.ac.jp   Hideki Imai, Institute of Industrial Science, University of Tokyo, 7-22-1 Roppongi, Minato-ku, Tokyo 106-8558, Japan, imai@iis.u-tokyo.ac.jp   Torleiv Kløve, Department of Informatics, University of Bergen, Pb. 7800, N-5020 Bergen, Norway, Torleiv.Klove@ii.uib.no   P. R. Kumar, University of Illinois, CSL 1308 West Main St., Urbana, IL 61801, USA, prkumar@decision.csl.uiuc.edu   X. Rong Li, Dept of Electrical Engineering, University of New Orleans, Lakefront, New Orleans, LA 70148, USA, xli@uno.edu   Clyde Martin, Department of Mathematics, Texas Tech University, Lubbock, TX 79409, USA, martin@math.ttu.edu   Bozenna Pasik-Duncan, Department of Mathematics, The University of Kansas, Lawrence, KS 66045-2142, USA, bozenna@math.ku.edu   Gilbert Strang, Department of Mathematics, Massachusetts Institute of Technology, Cambridge MA 02139, USA, gs@math.mit.edu   Hector Sussmann, Department of Mathematics, Hill Center - Busch Campus, Rutgers, the State University of New Jersey, Piscataway, NJ 08854-8019, USA, Sussmann@math.rutgers.edu   Serge Vaudenay, EPFL SSC, CH-1015 Lausanne, Switzerland, serge.vaudenay@epfl.ch   Venugopal Veeravalli, University of Illinois , 128 CSRL, 1308 West Main Street, Urbana, IL 61801, USA, vvv@comm.csl.uiuc.edu   Sergio Verdu, Dept of Elec. Engr., Princeton University, Princeton, NJ 08540, USA, verdu@princeton.edu   Andrew Chi-Chih Yao, Center for Advanced Study, Tsinghua University, Beijing 100084, P. R. China, andrewcyao@yahoo.com